Bontang, East Kalimantan (ANTARA) - Industry Minister Agus Gumiwang Kartasasmita has stated that the development of chip design is the foundation for achieving national independence in the semiconductor industry.
In a statement received here on Friday, he said the government is strengthening an integrated semiconductor ecosystem amid rising demand for strategic components across priority sectors, including electronics, automotive, telecommunications, energy, and digital transformation.
“The national semiconductor development cannot be carried out instantly, but must be pursued through a gradual and realistic approach by placing talent and chip design in the early stage,” he said.
In the electronics sector, national mobile phone production ranges from 30 million to 60 million units per year, while laptop demand is targeted to reach 1.57 million units by 2026.
In the automotive sector, Indonesia’s motor vehicle production in 2025 was recorded at 803,867 units, including electric and hybrid vehicles, which contain up to three times more semiconductor components than conventional vehicles.
The minister explained that Indonesia has several foundations in the semiconductor ecosystem, including assembly and testing facilities integrated into the Global Value Chain (GVC) and integrated circuit design companies.
The country also has a downstream industrial base such as electronic manufacturing services (EMS), original equipment manufacturers (OEMs), and the national automotive industry.
However, high dependence on imported semiconductors remains a challenge to industrial resilience.
“The high dependence on semiconductor imports is a signal for national industrial resilience. This condition must be addressed by strengthening the domestic ecosystem in chip design and intellectual property development,” he said.
The Ministry has established a roadmap for semiconductor industry development with a vision of positioning Indonesia as an active player in the global supply chain.
The roadmap covers the strengthening of four main pillars, namely materials, design, fabrication (front end), and assembly-testing-packaging (back end), which is supported by human resources, research and innovation, infrastructure, and supportive policies.
